Manufacturing Capabilities
Real limits, backed by a network of IATF 16949 / ISO 9001 / UL-certified factories. If your design pushes past a number below, send it anyway — we'll tell you honestly whether it's doable, and which partner is best for it.
- Base materials
- FR-4, Aluminum MCPCB (single-sided / 2-layer / 3-layer), Copper base, PTFE, Hydrocarbon, Ceramic
- Max layers
- FR-4: up to 16 layers · Aluminum MCPCB: up to 3 layers
- Copper weight
- 1 oz – 12 oz (400 μm), heavy-copper up to 3 oz with via plug fill
- Min trace / space
- 3 mil / 3 mil
- Min hole size
- 0.15 mm (mechanical), laser microvias available
- Via technology
- Through / Blind / Buried / Depth-controlled blind vias / HDI, resin plug, via-in-pad (POFV), metallized slots (min 0.5 × 12 mm)
- Thermal management (MCPCB)
- Conductivity up to 3 W/m·K; thermal-separation copper base up to 380 W; proprietary TL2301 ceramic insulation coating (−85 °C to 400 °C, >50 kV/mm dielectric strength)
- Hybrid lamination
- FR-4 + aluminum MCPCB hybrid, PTFE high-frequency mixed-material builds
- Surface finish
- Flash gold, Immersion gold (ENIG), Lead-free HASL, Immersion tin, OSP (Entek), Immersion silver
- Impedance control
- Yes — FR-4 6L+ with controlled-impedance stack-ups
- Max board size
- FR-4 single/double & aluminum: 600 × 1,500 mm · Multilayer: 600 × 800 mm · Ultra-long boards up to 1,000 mm (FR-4 4L) available
- Board thickness range
- FR-4: 0.2 – 4.0 mm · Multilayer: 0.4 – 4.0 mm · Aluminum MCPCB: 0.4 – 3.2 mm
- Quality standards
- IPC-600 Class 2 / Class 3, GB/T 4588, 94V-0 flammability
- Testing & inspection
- AOI + AVI optical inspection, electrical test (10–300 V), impedance TDR, thermal shock (288 °C × 10 s × 3 cycles), peel strength ≥ 1.4 N/mm, cross-section analysis
Proprietary technology: TL2301 ceramic coating
We develop our own thermal-management materials — not just resell factory stock. The TL2301 series is a high-temperature ceramic insulation coating engineered for metal-core PCBs: operating range −85 °C to 400 °C, dielectric strength >50 kV/mm, thermal conductivity 3 W/m·K. Ideal for high-voltage power, automotive ECU, LED engine, and IGBT substrates where standard solder mask won't survive.
Industries we've shipped into
Automotive
Volume production for tier-1 and tier-2 automotive suppliers. IATF 16949 certified — the quality management standard the automotive supply chain demands.
Medical & dental
Production boards for dental imaging and medical devices where reliability is non-negotiable. Clean-room assembly and full traceability.
Semiconductor
R&D and prototype builds for semiconductor test and packaging applications — heavy copper (400 μm), extreme thermal performance, sub-mil registration.